Apparatus and methods for packaging electronic devices for...

Details Apparatus and methods for packaging electronic devices for... Apparatus and methods for packaging electronic devices for...

2005-03-21

2009-12-22

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S433000, C257S448000, C257S680000

Reexamination Certificate

active

07635904

ABSTRACT:
Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.

REFERENCES:
patent: 5763903 (1998-06-01), Mandai et al.
patent: 6093941 (2000-07-01), Russell et al.
patent: 6130448 (2000-10-01), Bauer et al.
patent: 6972480 (2005-12-01), Zilber et al.
patent: 7061065 (2006-06-01), Horng et al.

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