Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed
Reexamination Certificate
2004-09-23
2009-10-27
Lindsay, Jr., Walter L (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
Optical characteristic sensed
C438S462000, C356S401000, C356S620000, C702S086000, C702S172000
Reexamination Certificate
active
07608468
ABSTRACT:
Disclosed are techniques and apparatus are provided for determining overlay error or pattern placement error (PPE) across the field of a scanner which is used to pattern a sample, such as a semiconductor wafer or device. This determination is performed in-line on the product wafer or device. That is, the targets on which overlay or PPE measurements are performed are provided on the product wafer or device itself. The targets are either distributed across the field by placing the targets within the active area or by distributing the targets along the streets (the strips or scribe areas) which are between the dies of a field. The resulting overlay or PPE that is obtained from targets distributed across the field may then be used in a number of ways to improve the fabrication process for producing the sample. For instance, the resulting overlay or PPE may be used to more accurately predict device performance and yield, more accurately correct a deviating photolithography scanning tool, or determine wafer lot disposition.
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Adel Michael E.
Ghinovker Mark
Poplawski Jorge
Seligson Joel L.
KLA-Tencor Technologies Corp.
Lindsay, Jr. Walter L
Pompey Ron E
Weaver Austin Villeneuve & Sampson LLP
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