Apparatus and method of producing an electronic device

Details Apparatus and method of producing an electronic device Apparatus and method of producing an electronic device

1997-10-01

1999-12-28

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 67, 438710, B44C 122, H01L 2100

Patent

active

060076739

ABSTRACT:
A semiconductor substrate which is placed on a bottom electrode inside a chamber is dry-etched by creating plasma inside the chamber. By making the average surface roughness Ra of the bottom surface of a quartz-top plate placed on the bottom electrode be in a range of 0.2 to 5 .mu.m, adhesion between the quartz-top plate and the deposits caused by the dry etching is enhanced, and the number of particles suspended in the chamber is reduced. Furthermore, the function of enhancing the adhesion of deposits can be maintained even after cleaning of the quartz-top plate. As a result, the number of particles which adhere onto the semiconductor substrate is reduced and the semiconductor substrate can be processed in an extremely clean atmosphere.

REFERENCES:
patent: 4891499 (1990-01-01), Moslehi
patent: 5135629 (1992-08-01), Sawada et al.
patent: 5364488 (1994-11-01), Minato et al.
patent: 5451290 (1995-09-01), Salfelder
patent: 5474649 (1995-12-01), Kava et al.

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