Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2004-10-12
2010-10-12
Malsawma, Lex (Department: 2892)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C257SE21441, C438S158000
Reexamination Certificate
active
07811937
ABSTRACT:
The present invention relates to an apparatus and a method of fabricating a thin film transistor array substrate. The apparatus includes a dip strip component for stripping a photo-resist pattern and a thin film formed on a substrate by using a stripper; a removing part for removing residual photo-resist and thin film from the substrate; and a jet strip component for jetting the stripper to remove residual particles of photo-resist and thin film left on the substrate. The method of fabricating includes dipping a substrate in a stripper, wherein the substrate has a photo-resist pattern and a thin film, the thin film being formed on an entire surface of the substrate so as to cover the photo-resist pattern; removing residual photo-resist and thin film using the stripper; and removing particles of residual photo-resist and thin film left on the substrate.
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Cho Heung Lyul
Kwon Ob Nam
LG Display Co. Ltd.
Malsawma Lex
McKenna Long & Aldridge LLP
Ullah Elias
LandOfFree
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