Semiconductor device manufacturing: process – Making passive device
Reexamination Certificate
2006-08-15
2010-11-09
Le, Thao X (Department: 2892)
Semiconductor device manufacturing: process
Making passive device
C257S531000, C257SE21022
Reexamination Certificate
active
07829425
ABSTRACT:
An apparatus and method for wafer level fabrication of high value inductors directly on top of semiconductor integrated circuits. The apparatus and method includes fabricating a semiconductor wafer including a plurality of dice, each of the dice including power circuitry and a switching node. Once the wafer is fabricated, then a plurality of inductors are fabricated directly onto the plurality of dice on the wafer respectively. Each inductor is fabricated by forming a plurality of magnetic core inductor members on an interconnect dielectric layer formed on the wafer. An insulating layer, and then inductor coils, are then formed over the plurality of magnetic core inductor members over each die. A plated magnetic layer is formed over the plurality of inductors respectively to raise the permeability and inductance of the structure.
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Hopper Peter J.
Hwang Kyuwoon
Johnson Peter
Papou Andrei
Beyer Law Group LLP
Huber Robert
Le Thao X
National Semiconductor Corporation
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