Semiconductor device manufacturing: process – Making passive device
Reexamination Certificate
2011-03-01
2011-03-01
Malsawma, Lex (Department: 2892)
Semiconductor device manufacturing: process
Making passive device
C257S531000, C257SE21022
Reexamination Certificate
active
07897472
ABSTRACT:
Methods for forming multiple inductors on a semiconductor wafer are described. A plating layer and a photoresist layer are applied over a semiconductor wafer. Recess regions are etched in the photoresist layer using photolithographic techniques, which exposes portions of the underlying plating layer. Metal is electroplated into the recess regions in the photoresist layer to form multiple magnetic core inductor members. A dielectric insulating layer is applied over the magnetic core inductor members. Additional plating and photoresist layers are applied over the dielectric insulating layer. Recess regions are formed in the newly applied photoresist layer. Electroplating is used to form inductor windings in the recess regions. Optionally, a magnetic paste can be applied over the inductor coils.
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Hopper Peter J.
Hwang Kyuwoon
Johnson Peter
Papou Andrei
Beyer Law Group LLP
Huber Robert
Malsawma Lex
National Semiconductor Corporation
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