Apparatus and method for treating edge of substrate

Details Apparatus and method for treating edge of substrate Apparatus and method for treating edge of substrate

2007-01-23

2007-01-23

Hassanzadeh, Parviz (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C134S198000, C134S902000

Reexamination Certificate

active

10884533

ABSTRACT:
An apparatus for treating an edge of a semiconductor substrate includes an etchant supply nozzle for supplying a first etchant to the edge of the semiconductor substrate. The apparatus further includes a shielding cover for preventing an etchant from flowing to a shielding surface of the semiconductor substrate. The shielding cover is movable in an upward and downward direction. The apparatus also includes a device for cleaning the edge of the semiconductor substrate. According to the apparatus, after a wafer edge is etched, foreign substances remaining at the wafer edge is efficiently removed.

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