Apparatus and method for the processing of solid materials,...

Dentistry – Apparatus – Having means to emit radiation or facilitate viewing of the...

Reexamination Certificate

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C433S215000, C606S012000, C250S492220

Reexamination Certificate

active

06709269

ABSTRACT:

FIELD OF THE INVENTION
The invention concerns methods and apparatus for the processing of solid materials, including hard tissues, metals, ceramics, crystals, glass, certain plastics, etc. and uses thereof in dentistry, surgery, orthopedics and other material processing applications.
BACKGROUND OF THE INVENTION
Laser radiation is widely used for the processing of hard materials: drilling, cutting, modification of properties and other operations. The mechanism for destruction of hard materials under the influence of laser radiation involves the absorption of laser energy, which results in heating, melting and evaporation of the materials. Other mechanisms involve absorption of radiation by strongly absorptive materials (chromophores), their heating and the breaking of the material because of pressure around the absorptive materials. The process of laser destruction of materials under the influence of short pulses (generally pulses shorter than the thermal relaxation time of the target) is sometimes called laser ablation. In order to reach the maximum efficiency of material removal, the wavelength of the laser radiation is selected to be within the range of maximum absorption for the absorptive material. Depending on the properties of the material, the optimum parameters of laser radiation are selected. These parameters include the wavelength, the pulse duration, the diameter of laser beam spot, and the energy or power. Laser destruction of hard materials has a lot of advantages; however, in many cases it is slower than drilling or other mechanical methods of processing.
Russian certificate of invention USSR N 1593669, published Sep. 23, 1990, discusses the removal of hard tooth tissues by radiation with 2.94 &mgr;m wavelength (Er:YAG laser), with pulse duration of 100-500 &mgr;s and with energy of 0.5-1 J. U.S. Pat. No. 5,257,935 issued Oct. 2, 1993 proposes a laser with a wavelength within the range 1.5-3.5 &mgr;m, in particular 2.94 &mgr;m, for the same objective. The radiation in this device is delivered from the laser to the processing zone using an optical fiber connected to a tip in contact with a tooth surface. The disadvantage of this method and apparatus is that the speed of material removal is slower than for high-speed drills. Its use therefore results in an increase in procedure duration. However, the laser procedure is in most cases painless and does not require anesthesia. The laser processing is also less traumatic.
In the apparatus and method disclosed in the U.S. Pat. No. 5,409,376, issued Apr. 25, 1995, mechanical drilling is combined with laser drilling in order to increase the speed of processing. However, this increases the price of both the treatment process and the drilling apparatus. Further, when used for the processing of dental tissues, it results in the loss of the main advantages of laser processing—absence of pain and low danger of trauma.
A major disadvantage of the techniques discussed above is insufficient utilization of the laser energy. This is due to the fact that a significant part of the laser pulse energy absorbed by the processed material is transformed to mechanical energy of particles leaving the zone of processing, this energy being uselessly spent in heating the environment. Similar issues can arise when a laser is used to ablate solid materials other than dental tissue.
SUMMARY OF THE INVENTION
In accordance with the above, this invention, in accordance with a first aspect thereof, provides a method of processing a solid material which includes exposing the material to pulsed radiation with an energy above an ablation threshold for the material; and returning or otherwise directing particles of ablated material to a region of processing of the material to further influence material processing. Some of the particles of ablated material will be deposited on a surface adjacent the region of processing, the method including returning these deposited particle to the region of processing in response to the next radiation pulse to further process the material. While the region of processing is the source of the particles of ablated material for a preferred embodiment, other sources of particles may also exist, either in addition to or instead of the preferred source, which particles can be delivered to the region of processing for the further processing of the material. Potential sources for such added material include a tip through which radiation is delivered, reflectors surrounding the tip and/or an additional piece of material positioned between the radiation source and the region of processing which may be ablated by radiation passing therethrough to produce accelerated particles. For a preferred embodiment, the material being processed is a dental material, for example dental enamel, dentin, bone, stain, filling material, cementum and the like. For such embodiments, the pulsed radiation is preferably from a laser with a wavelength within one of the bands 1.9-2.1 &mgr;m, 2.65-3.5 &mgr;m, 5.6-7.5 &mgr;m, and 8.5-11 &mgr;m; a duration of 0.0001-10000 &mgr;s (preferably 1-500 &mgr;s); and an energy density of 0.5-500 J/cm
2
. The method may also include cooling the region of processing of the material and/or removing particles from an area between a source of the pulsed radiation and the region of processing, these steps preferably being performed between pulses of the radiation for some embodiments. For another embodiment, air is first applied to the region of processing to clean at least the area. A light water spray or mist is then applied to both cool the area and to be ablated, the laser or other radiation source being fired during the applications of the mist. After the firing of the radiation source, the misting or a stronger water spray may be applied to cool the region of processing. While the three steps indicated above are preferably used together, for some embodiments, one or more of these steps may be individually performed.
The invention also includes a device for processing a solid material which includes a source of pulsed radiation and a system for delivering radiation from the source through a tip to a region of processing, the tip including an end for delivering radiation to at least one particle source, the radiation accelerating particles from the particle source, which particles are accelerated and/or reflected to a region of processing on the surface of the solid material to influence the processing thereof. For preferred embodiments, the particle source is the region of processing on the surface of the solid material, the radiation ablating the surface to create particles of ablation accelerated away from the surface, at least some of these particles being reflected back to the region of processing by at least one of the tip and a reflector surrounding the tip to further process the surface. The radiation and the reflected particles may impinge on substantially the same point in a region of processing or they may impinge on different points in this region to increase the area being processed.
At the end of at least some radiation pulses, some particles of ablation may adhere to the tip or other surfaces adjacent the area of processing, and these adhered particles may serve as an additional particle source for a subsequent radiation pulse, the adhered particles being ablated by such radiation pulse so as to be accelerated toward the region of processing. For some embodiments, the tip has an end facet shape to function as a reflector for the particles. At least a portion of the tip may also be ablated by the radiation, the ablated portion of the tip being a source of particles for delivery to the region of processing. A unit may also be positioned between the tip and the region of processing which unit is ablated by radiation applied thereto to produce particles of ablation directed to the region of processing. A mechanism may be provided for advancing the portion of the unit between the tip and the region of processing as the unit is ablated. For preferred embodiments, the source of pulsed radiation is a pulsed las

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