Apparatus and method for testing component built in circuit...

Details Apparatus and method for testing component built in circuit... Apparatus and method for testing component built in circuit...

2008-03-18

2008-03-18

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S048000, C257S786000, C257SE23020, C257SE21521, C324S523000, C324S527000, C324S765010

Reexamination Certificate

active

11131741

ABSTRACT:
A multi-layered circuit board a built-in component including multiple terminals, at least one signal pad formed on a top surface of the multi-layered circuit board for signal transmission, each of the at least one signal pad corresponding to one of the multiple terminals, and at least one test pad formed on the top surface of the multi-layered circuit board, each of the at least one test pad corresponding to one of the at least one signal pad for testing an electric path extending from the one signal pad through the one terminal to the each of the at least one test pad.

REFERENCES:
patent: 5110664 (1992-05-01), Nakanishi et al.
patent: 5989782 (1999-11-01), Nishiki et al.
patent: 6400576 (2002-06-01), Davidson
patent: 6577490 (2003-06-01), Ogawa et al.
patent: 6876216 (2005-04-01), Fu-Chin
patent: 2003/0235929 (2003-12-01), Cowles et al.

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