Apparatus and method for surface treatment

Details Apparatus and method for surface treatment Apparatus and method for surface treatment

1997-07-10

2000-03-07

Dang, Thi

Etching a substrate: processes

Gas phase etching of substrate

Application of energy to the gaseous etchant or to the...

156345, 118723E, H05H 100

Patent

active

060335866

ABSTRACT:
Front and reverse surfaces of a workpiece are treated with plasma simultaneously while the workpiece is arranged between electrodes in such a manner that one of the electrode is opposite to the front surface, and another of the electrodes is opposite to the back surface, and a voltage supplied to each of the electrodes is changed frequently.

REFERENCES:
patent: 4616597 (1986-10-01), Kaganowicz
patent: 4618477 (1986-10-01), Babu et al.
patent: 4724296 (1988-02-01), Morley
patent: 5057185 (1991-10-01), Thomas, III et al.
patent: 5314603 (1994-05-01), Sugiyama et al.
patent: 5462898 (1995-10-01), Chen et al.

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