Apparatus and method for slicing an ingot

Details Apparatus and method for slicing an ingot Apparatus and method for slicing an ingot

2008-04-08

2008-04-08

Morgan, Eileen P. (Department: 3723)

Stone working

Sawing

Reciprocating

C125S021000, C083S651100

Reexamination Certificate

active

11734773

ABSTRACT:
A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.

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Patent Abstracts of Japan, Publication No. 09-262827; Date of Publication: Oct. 7, 1997; in the name of Nakazato Yasuaki et al.

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