Apparatus and method for setting zero point of Z-axis in a wafer

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324754, 324758, 3241581, G01R 3102

Patent

active

061604151

ABSTRACT:
An apparatus and method for setting zero point of Z-axis in a semiconductor wafer probe station are disclosed. The device includes a base with flat bottom surface; a circuit tester mounted in top portion of the base; and first and second conductive parts attached at either sides of the base, in which two probe leads of the tester are connected therewith, and the first and second conductive parts extending over a bottom portion of the base and being electrically separated on the bottom portion of the base, wherein, when the device is placed on a wafer chuck top area, the first conductive part covers vacuum pins provided in the chuck top and the second conductive part excludes any of the vacuum pins. An output of the circuit tester indicates if the pins and the wafer chuck are level. The method includes initializing the probe station to reset X/Y-axis thereof; positioning a level check device including a circuit tester on the wafer chuck to allow a first conductive part of the level check device to be in contact with vacuum pins of the wafer chuck and a second conductive part of the level check device, electrically separated from the first conductive part, not in contact with any vacuum pins of the wafer chuck; and raising the wafer chuck until the circuit tester indicates the wafer chuck is level with the vacuum pins. The apparatus and method minimize measuring errors in leveling the chuck top with the vacuum pins and reduce setting time.

REFERENCES:
patent: 3585480 (1971-06-01), Kirkpatrick
patent: 5539676 (1996-07-01), Yamaguchi
patent: 5642056 (1997-06-01), Nakajima et al.
patent: 5691764 (1997-11-01), Takeoshi et al.
patent: 5945239 (1999-08-01), Taniguchi
patent: 6043668 (2000-03-01), Carney

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