Apparatus and method for semiconductor planarization

Abrading – Abrading process – Utilizing fluent abradant

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451 36, 451 41, 451 59, 451288, 451527, 451530, 451533, 451550, B24B 100, B24D 1100

Patent

active

061358568

ABSTRACT:
The disclosed polishing apparatus includes a lower pad and an upper pad. The upper pad is disposed over the lower pad and has an upper abrasive surface. The lower pad has an upper surface defining one or more grooves. When the upper pad is placed over the lower pad, channels may form in the upper pad abrasive surface over the grooves. These channels improve the distribution of slurry in the polishing apparatus. The upper pad may define a first polishing region and a second polishing region, the total area of channels in the first polishing region being greater than the total area of the channels in the second polishing region.

REFERENCES:
patent: 3128580 (1964-04-01), Davis
patent: 3795932 (1974-03-01), Young
patent: 3921342 (1975-11-01), Day
patent: 4728552 (1988-03-01), Jensen, Jr.
patent: 4811443 (1989-03-01), Nishizawa
patent: 4841680 (1989-06-01), Hoffstein et al.
patent: 4927432 (1990-05-01), Budinger et al.
patent: 4959113 (1990-09-01), Roberts
patent: 5177908 (1993-01-01), Tuttle
patent: 5210472 (1993-05-01), Casper
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5264010 (1993-11-01), Brancaleoni et al.
patent: 5382272 (1995-01-01), Cook et al.
patent: 5389352 (1995-02-01), Wang
patent: 5391258 (1995-02-01), Brancaleoni et al.
patent: 5450647 (1995-09-01), Dorsey
patent: 5601474 (1997-02-01), Takahashi
patent: 5888121 (1999-03-01), Kirchner et al.

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