Apparatus and method for selectively etching a plastic encapsula

Details Apparatus and method for selectively etching a plastic encapsula Apparatus and method for selectively etching a plastic encapsula

1992-09-28

1993-10-12

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156668, 156345, B44C 122, B29C 3700

Patent

active

052521796

ABSTRACT:
A method and apparatus for selectively spray etching an epoxy encapsulated chip which is mounted to a chip carrier without damage to the chip, the chip carrier or other closely mounted chips. The apparatus includes a diaphragm which can be raised and lowered to direct the flow of etchant solution at the encapsulating material located alongside and under the chip. The encapsulating material is removed from the chip without removing the chip from the chip carrier.

REFERENCES:
patent: 3969813 (1976-07-01), Minetti et al.
patent: 4359360 (1982-12-01), Harris et al.
patent: 4366925 (1983-01-01), Fanene
patent: 4384917 (1983-05-01), Wensink
patent: 4392617 (1983-07-01), Bakos et al.
patent: 4826556 (1989-05-01), Kobayashi
"Electronic Circuits-Preserving Technique for Decapsulating Plastic Packages," IBM Technical Disclosure Bulletin, vol. 30, No. 6, Nov. 1987, pp. 446 and 447.

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