Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Reexamination Certificate
2007-12-25
2007-12-25
Vinh, Lan (Department: 1765)
Etching a substrate: processes
Gas phase etching of substrate
Application of energy to the gaseous etchant or to the...
C216S058000, C216S067000, C438S706000, C438S710000
Reexamination Certificate
active
10608384
ABSTRACT:
Reactive atom plasma processing can be used to shape, polish, planarize, and clean surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, clean and/or deposit material on the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from, and/or redistributing material on, the surface of the workpiece.This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.
REFERENCES:
patent: 4050408 (1977-09-01), Beucherie
patent: 4306175 (1981-12-01), Schleicher
patent: 4431898 (1984-02-01), Reinberg
patent: 4431901 (1984-02-01), Hull
patent: 4532199 (1985-07-01), Ueno
patent: 4674683 (1987-06-01), Fabel
patent: 5000771 (1991-03-01), Fleming et al.
patent: 5007771 (1991-04-01), Fu et al.
patent: 5106827 (1992-04-01), Borden
patent: 5200595 (1993-04-01), Boulos
patent: 5238532 (1993-08-01), Zarowin
patent: 5254830 (1993-10-01), Zarowin
patent: 5256205 (1993-10-01), Schmitt, III
patent: 5280154 (1994-01-01), Cuomo
patent: 5290382 (1994-03-01), Zarowin
patent: 5291415 (1994-03-01), Zarowin
patent: 5292400 (1994-03-01), Mumola
patent: 5298103 (1994-03-01), Steinberg
patent: 5336355 (1994-08-01), Zarowin
patent: 5344524 (1994-09-01), Sharma
patent: 5346578 (1994-09-01), Benzing
patent: 5364496 (1994-11-01), Bollinger
patent: 5372674 (1994-12-01), Steinberg
patent: 5375064 (1994-12-01), Bollinger
patent: 5376224 (1994-12-01), Zarowin
patent: 5386119 (1995-01-01), Ledger
patent: 5405480 (1995-04-01), Benzing
patent: 5419803 (1995-05-01), Mumola
patent: 5430355 (1995-07-01), Paranjpe
patent: 5563709 (1996-10-01), Poultney
patent: 5591068 (1997-01-01), Taylor
patent: 5650032 (1997-07-01), Keller
patent: 5676863 (1997-10-01), Jouvenel
patent: 5683548 (1997-11-01), Hartig
patent: 5688415 (1997-11-01), Bollinger
patent: 5767627 (1998-06-01), Siniaguine
patent: 5795493 (1998-08-01), Bukhman
patent: 5811021 (1998-09-01), Zarowin
patent: 5811022 (1998-09-01), Savas
patent: 5863829 (1999-01-01), Nakayoshi
patent: 5877471 (1999-03-01), Huhn
patent: 5897712 (1999-04-01), Hanawa
patent: 5942445 (1999-08-01), Kato
patent: 5944902 (1999-08-01), Redeker
patent: 5955383 (1999-09-01), Hwang
patent: 5961772 (1999-10-01), Selwyn
patent: 5965034 (1999-10-01), Vinogradov
patent: 5981392 (1999-11-01), Oishi
patent: 6004866 (1999-12-01), Nakano
patent: 6017221 (2000-01-01), Flamm
patent: 6028286 (2000-02-01), Wicker
patent: 6030489 (2000-02-01), Hwang
patent: 6040548 (2000-03-01), Siniaguine
patent: 6041623 (2000-03-01), Fleming, Jr.
patent: 6056848 (2000-05-01), Daviet
patent: 6068784 (2000-05-01), Collins
patent: 6073578 (2000-06-01), Shim
patent: 6074947 (2000-06-01), Mumola
patent: 6085688 (2000-07-01), Lymberopoulos
patent: 6093655 (2000-07-01), Donohoe
patent: 6105534 (2000-08-01), Siniaguine
patent: 6139678 (2000-10-01), Siniaguine
patent: 6143129 (2000-11-01), Savas
patent: 6153852 (2000-11-01), Blutke
patent: 6170428 (2001-01-01), Redeker
patent: 6194036 (2001-02-01), Babayan
patent: 6200908 (2001-03-01), Vandamme
patent: 6203661 (2001-03-01), Siniaguine
patent: 6207924 (2001-03-01), Trassy
patent: 6209480 (2001-04-01), Moslehi
patent: 6214161 (2001-04-01), Becker
patent: 6218640 (2001-04-01), Selitser
patent: 6228330 (2001-05-01), Herrmann
patent: 6238587 (2001-05-01), Siniaguine
patent: 6239004 (2001-05-01), Aga
patent: 6239553 (2001-05-01), Barnes
patent: 6245202 (2001-06-01), Edamura
patent: 6534921 (2003-03-01), Seo et al.
patent: 6660177 (2003-12-01), Carr
patent: 2004/0173316 (2004-09-01), Carr
patent: 199 25 790 (2000-12-01), None
patent: 199 25 790 A 1 (2000-12-01), None
patent: 0 546 842 (1993-06-01), None
patent: WO 02/61171 (2002-08-01), None
Takino et al, Computer numerically controlled plasma chemical vaporization machining with a pipe electrode for optical fabrication, Applied Optics, vol. 37, No. 22, pp. 5199-5210, Aug. 1, 1998.
PCT/US04/06773, International Search Report Mailed Oct. 31, 2005, published Mar. 2004.
Supplementary European Search Report, EP 02706064.9 for PCT/US0202605 mailed Dec. 21, 2006, 4 pages.
C. B. Zarowin, et al. “Rapid-Non-Contact, Damage Free Shaping of Optical&Other Surfaces with Plasma Assisted Chemical Etching, 43rdAnnual Symposium on Frequency Control”, 1989, pp. 623-626.
Fliesler & Meyer LLP
Rapt Industries Inc.
Vinh Lan
LandOfFree
Apparatus and method for reactive atom plasma processing for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for reactive atom plasma processing for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for reactive atom plasma processing for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3886391