Metal fusion bonding – Process – Using high frequency vibratory energy
Reexamination Certificate
2007-11-15
2009-10-06
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Process
Using high frequency vibratory energy
C228S004500, C228S180500
Reexamination Certificate
active
07597235
ABSTRACT:
One aspect relates to a bonding apparatus for producing a bonding connection between a bonding wire and a bonding partner. The bonding apparatus includes a heel shaper, which is provided for avoiding damage to the bonding wire in the heel region during the bonding operation.One aspect relates to a method for producing a bonding connection by means of a bonding apparatus having a heel shaper and a bonding stamp. The heel shaper is situated relative to the bonding stamp in a first active position or can be moved into such a first active position. In the first active position, the heel shaper ensures that the bonding wire runs in a permissible region in the heel region.
REFERENCES:
patent: 4030657 (1977-06-01), Scheffer
patent: 4619397 (1986-10-01), Urban
patent: 4765526 (1988-08-01), Sato
patent: 4976392 (1990-12-01), Smith et al.
patent: 5018658 (1991-05-01), Farassat
patent: 5190206 (1993-03-01), Miller et al.
patent: 5365657 (1994-11-01), Brown et al.
patent: 5452838 (1995-09-01), Farassat
patent: 5452841 (1995-09-01), Sibata et al.
patent: 5495976 (1996-03-01), Mironesco et al.
patent: 5564616 (1996-10-01), Torihata et al.
patent: 5906706 (1999-05-01), Farassat
patent: 6206275 (2001-03-01), Biggs
patent: 6439448 (2002-08-01), Ringler
patent: 6471116 (2002-10-01), Copperthite
patent: 6513696 (2003-02-01), Ho et al.
patent: 6667625 (2003-12-01), Miller
patent: 6827248 (2004-12-01), Farassat
patent: 6905058 (2005-06-01), Farassat
patent: 7216794 (2007-05-01), Lange et al.
patent: 7311239 (2007-12-01), Laurent et al.
patent: 7407079 (2008-08-01), Copperthite et al.
patent: 7451905 (2008-11-01), Bell
patent: 7458496 (2008-12-01), Farassat
patent: 7461768 (2008-12-01), Walther
patent: 2003/0192414 (2003-10-01), Farassat
patent: 2004/0011848 (2004-01-01), Farassat
patent: 2005/0150932 (2005-07-01), Hosseini
patent: 2005/0279811 (2005-12-01), Bell
patent: 2006/0071049 (2006-04-01), Farassat
patent: 2006/0157537 (2006-07-01), Walther
patent: 2006/0278682 (2006-12-01), Lange et al.
patent: 2009/0127317 (2009-05-01), Siepe et al.
Dicke, Billig & Czaja P.L.L.C.
Infineon - Technologies AG
Stoner Kiley
LandOfFree
Apparatus and method for producing a bonding connection does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for producing a bonding connection, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for producing a bonding connection will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4139036