Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent
1995-06-02
1999-08-31
Powell, William
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
156345, 216 88, 438747, H01L 2100
Patent
active
059453478
ABSTRACT:
An apparatus and method for preventing gimballing in the polishing of a semiconductor wafer held in an overhanging position with respect to a polishing pad. One embodiment includes a support apparatus for use with a device for polishing a semiconductor wafer, the device having a rotatable wafer carrier and a polishing pad attached to a rotatable platen, the wafer carrier being movable to place a semiconductor wafer held by the wafer carrier in a contacting and overhanging relationship with the polishing pad. The support apparatus includes a support to prevent gimballing of the wafer carrier when the wafer held by the wafer carrier is in the overhanging and contacting relationship with the polishing pad, the support having a low polishing surface to contact and support the semiconductor wafer. Another embodiment includes a supporting pad for use with a polishing pad, the supporting pad including a ring having an inner diameter greater than the outer diameter of the polishing pad, the ring having a supporting surface of a material with low polishing characteristics. A method for assembling polishing pads to a circular platen and a process for polishing a semiconductor wafer are also disclosed.
REFERENCES:
patent: Re34425 (1993-11-01), Schultz
patent: 5081796 (1992-01-01), Schultz
patent: 5194344 (1993-03-01), Cathey, Jr. et al.
patent: 5197999 (1993-03-01), Thomas
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5245790 (1993-09-01), Jerbic
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5302233 (1994-04-01), Kim et al.
patent: 5310455 (1994-05-01), Pasch et al.
patent: 5314843 (1994-05-01), Yu et al.
patent: 5329734 (1994-07-01), Yu
patent: 5593537 (1997-01-01), Cote et al.
Micro)n Technology, Inc.
Powell William
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