Apparatus and method for polishing a semiconductor wafer

Details Apparatus and method for polishing a semiconductor wafer Apparatus and method for polishing a semiconductor wafer

1996-12-23

1999-07-20

Rose, Robert A.

Abrading

Machine

Rotary tool

451 41, B24B 722

Patent

active

059249161

ABSTRACT:
An apparatus for polishing semiconductor wafers is provided which is capable of efficiently polishing the semiconductor wafers one-by-one by a multi-step polishing, capable of preventing occurrence of spots and scratches due to attachment and detachment to and from top rings, and capable of polishing the semiconductor wafers with high-flatness surfaces. The polish apparatus includes a plurality of holding shafts for holding the semiconductor wafers, a polish table on which the semiconductor wafers are placed and polished, and means for upwardly and downwardly moving the semiconductor wafers which are held by the holding shafts, in which the upward and downward movement of the holding shafts and the attachment and detachment of the semiconductor wafers to and from the holding shafts are independently carried out for each of the holding shafts.

REFERENCES:
patent: 3611654 (1971-10-01), Weber
patent: 4009539 (1977-03-01), Day
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5562524 (1996-10-01), Gill, Jr.

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