Apparatus and method for planarization of spin-on materials

Details Apparatus and method for planarization of spin-on materials Apparatus and method for planarization of spin-on materials

1997-10-06

2000-09-26

Bowers, Charles

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Utilizing reflow

118 52, H01L 2131

Patent

active

061242152

ABSTRACT:
An improved and new apparatus and process for planarization of spin-on materials has been developed. The key features of the apparatus and the process are an enclosure surrounding the spin-on table and substrate and the application of a planarization pressure plate to the substrate, subsequent to dispersal of the spin-on materials and during rotation of the substrate.

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patent: 4794021 (1988-12-01), Potter
patent: 5302233 (1994-04-01), Kim et al.
patent: 5312512 (1994-05-01), Allman et al.
patent: 5454871 (1995-10-01), Liaw et al.
patent: 5716673 (1998-02-01), Yen et al.
Stanley Wolf Silicon Processing for the VSLI Era vol. 2 Lattice press p. 232, 1990.

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