Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2007-04-17
2007-04-17
McPherson, John A. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C257S434000, C257S433000, C257S435000, C250S239000, C250S208100
Reexamination Certificate
active
10666921
ABSTRACT:
An method and apparatus for fabricating a die having imaging circuitry and fabricating a lid having a transparent region and support regions having a predetermined height. The lid is fabricated by applying a photo-sensitive adhesive layer with a thickness substantially equal to the predetermined height to a transparent plate and patterning the photo-sensitive adhesive layer to form the transparent region and the support regions. Once fabrication of the lid is complete, it is mounted directly onto the die so that the transparent region generally covers the imaging circuitry. The resulting apparatus includes a lid mounted directly onto the die with the transparent region generally positioned above the imaging circuitry. A gap, having a height dimension substantially equal to the predetermined height of the support regions of the lid, is spaced between the transparent region of the lid and the imaging circuitry on the die.
REFERENCES:
patent: 4697203 (1987-09-01), Sakai et al.
patent: 5734156 (1998-03-01), Dahlin et al.
patent: 5818094 (1998-10-01), Matsuo
patent: 5920142 (1999-07-01), Onishi et al.
patent: 6075237 (2000-06-01), Ciccarelli
patent: 6117193 (2000-09-01), Glenn
patent: 6291884 (2001-09-01), Glenn et al.
patent: 6873024 (2005-03-01), Prabhu et al.
patent: 2005/0030505 (2005-02-01), Miwa
Website http://www.shellcase.com/pages/products.asp,. downloaded Jul. 23, 2003, 2 pages.
Website http://www.shellcase.com/pages/products-shellOP-process.asp, downloaded Jul. 23, 2003, 4 pages.
Website www.hanagroup.com/h—hmti.htm. “Hana Microdisplay Technologies, Inc.”, downloaded Sep. 17, 2003, Aug. 9, 2002.
Website http://www.shellcase.com, Shellcase, “SellOP Precess Flow,” Steps A-J, Oct. 2001.
Lee Shaw Wei
Prabhu Ashok
Beyer & Weaver, LLP
Chacko-Davis Daborah
McPherson John A.
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