Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-06-16
1994-02-01
Pal, Asok
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
358495, 156627, 156645, H01L 21306
Patent
active
052829219
ABSTRACT:
A method for optimally scanning, for example, a surface of one or more silicon-on-insulator (SOI) semiconductor wafers 10 consists of a spiral type scan technique. The spiral type scan can maintain a path pattern 30 that encompasses the surface diameter of a single SOI wafer 10. The spiral type scan can also maintain a path pattern 30 that encompasses the surface diameters of several SOI wafers 10. The path pattern 30 of the spiral type scan does not include any abrupt redirectional changes. Thus, the machinery controlling the path pattern 30 of the spiral type scan does not undergo unnecessary mechanical stresses. Furthermore, when using the spiral type scan in a chemical etching process of one or more SOI wafers 10 and the etch rate of a chemical etching probe 18 is modulated, the mechanical stresses are further reduced and there are minimal depreciative etching problems.
REFERENCES:
patent: 2912497 (1959-11-01), Parrott
patent: 2967907 (1961-01-01), Stamps
patent: 3806643 (1974-04-01), Russell
patent: 4423137 (1983-12-01), Rester
patent: 4509162 (1985-04-01), Rester
IBM Technical Disclosure Bulletin, vol. 18 #12, May 1976, p. 3914.
Denson-Low W. K.
Hughes Aircraft Company
Pal Asok
Sales Michael W.
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