Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2005-04-12
2005-04-12
Versteeg, Steven (Department: 1753)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S298040, C204S298150, C427S131000
Reexamination Certificate
active
06878240
ABSTRACT:
A sputtering system is provided with a substrate and a sputtering material layer that are located in a sputtering chamber. The sputtering material layer has a sputtering surface where atoms of the material are sputtered and the substrate has a forming surface with a site where atoms of the sputtered material are to be formed. The sputtering material layer has a sputtering center which is located at a center of the atoms to be sputtered and the aforementioned site has a periphery with a forming center at a center of the periphery. The sputtering center is offset from the forming center so that shadowing at outer extremities of photoresist masks near the periphery of the substrate is minimized.
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Bus-Kwofie Raymond
Freitag James Mac
Metin Lichiao
Pinarbasi Mustafa
Webb Patrick Rush
International Business Machines - Corporation
Johnston Ervin F.
Versteeg Steven
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