Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2005-06-14
2005-06-14
McDonald, Rodney G. (Department: 1753)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192110, C204S192130, C204S192200, C204S298030, C204S298040, C204S298090, C204S298110, C204S298150, C204S298160, C204S298230, C204S298250, C204S298260, C204S298270, C204S298280, C204S298290, C118S719000, C118S7230VE
Reexamination Certificate
active
06905578
ABSTRACT:
An apparatus and method for depositing plural layers of materials on a substrate within a single vacuum chamber allows high-throughput deposition of structures such as these for GMR and MRAM application. An indexing mechanism aligns a substrate with each of plural targets according to the sequence of the layers in the structure. Each target deposits material using a static physical-vapor deposition technique. A shutter can be interposed between a target and a substrate to block the deposition process for improved deposition control. The shutter can also preclean a target or the substrate and can also be used for mechanical chopping of the deposition process. In alternative embodiments, plural substrates may be aligned sequentially with plural targets to allow simultaneous deposition of plural structures within the single vacuum chamber. A monitoring and control device can be wed to optimize equipment state, process state, and wafer state parameters by sensing each respective state during or after the deposition process.
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Davis Cecil J.
Jakubik Dwain R.
Mann Christopher J.
Moslehi Mehrdad M.
Paranjpe Ajit P.
CVC Products Inc.
McDonald Rodney G.
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