Apparatus and method for molding simultaneously a plurality...

Details Apparatus and method for molding simultaneously a plurality... Apparatus and method for molding simultaneously a plurality...

2006-04-18

2006-04-18

Davis, Robert B. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

C425S120000, C425S129100, C425S136000, C425S169000, C425S170000, C425S544000, C425SDIG022

Reexamination Certificate

active

07029257

ABSTRACT:
Provided is a molding apparatus for molding simultaneously a plurality of semiconductor devices. The molding apparatus includes a mold, a plurality of plungers, and a plunger block. The mold is prepared to mold a plurality of semiconductor devices. The plurality of plungers are plunged into the mold to inject a molding compound that will encapsulate the semiconductor devices in the mold. The plurality of plungers are assembled with the plunge block to operate at the same time. Each of the plurality of plungers includes a load sensor and/or a contact sensor, so as to sense separately whether the plungers are improperly operating.

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Korean Utility Model Abstract, “Apparatus for Molding Semiconductor Package”, Publication No. P1998-067601. published Dec. 5, 1998: Application No. 1997-012186, application date: May 28, 1997 (Abstract in English).

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