Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Patent
1997-07-29
1999-08-10
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Automatic and/or material-triggered control
118 52, 118669, 156 87, 156295, 156305, 156357, 156359, 156578, B05B 500
Patent
active
059353759
ABSTRACT:
An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip. According to the present invention, the resin is supplied such that it is relatively less concentrated near the peripheral portions of the chip so the resin spreads throughout the entire gap at substantially the same time as it flows along the peripheral portion of the chip. Thus, the formation of resin-less voids in the gap is deterred so that the grade and quality of the semiconductor device is improved.
REFERENCES:
patent: 5362354 (1994-11-01), Okura et al.
Nakazawa Takahito
Nomura Hiroshi
Ohshima Yumiko
Kabushiki Kaisha Toshiba
Koehler Robert R.
Simmons David A.
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