Apparatus and method for joining two substrates

Details Apparatus and method for joining two substrates Apparatus and method for joining two substrates

2005-06-13

2008-05-13

Sherry, Michael (Department: 2836)

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

Reexamination Certificate

active

07372691

ABSTRACT:
A substrate attaching device (3) includes a vacuum chamber (31), a first electrostatic chuck (32) at least partly set in the vacuum chamber, and further includes a chuck body (321) with a plurality of gas releasing holes (322), a working table (33) stationable below the first electrostatic chuck in the vacuum chamber, a gas supply (34) communicating with the gas releasing holes, a pump device (35) communicating with the vacuum chamber, and a sub-vacuum (37) chamber communicating with both the vacuum chamber and the pump device.

REFERENCES:
patent: 6466426 (2002-10-01), Mok et al.
patent: 6496350 (2002-12-01), Fujiwara
patent: 6773762 (2004-08-01), Fukiage
patent: 526367 (2003-04-01), None

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