Apparatus and method for inspecting soldered portions

Optics: measuring and testing – Inspection of flaws or impurities – Having predetermined light transmission regions

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Details

2504581, 358106, G01N 2164, G01N 2188

Patent

active

047721251

ABSTRACT:
An apparatus for inspecting an appearance of soldered portions connected between the pads formed on a printed circuit board and leads of an electronic body part. A slit light beam is directed to portions to be inspected and scanned thereon with a light fluorescent image generated from the substrate portion of the printed circuit board and a dark fluorescent image generated from the leads, pads and soldered portions being detected with an image signal being generated in accordance therewith. The image signal is binarized and different functions are extracted from the binarized signal which functions are utilized in connection with other functions and previously obtained data to determine whether an abnormal portion is present or not in a predetermined position on the circuit board.

REFERENCES:
patent: 3950649 (1976-04-01), Yonekubo
patent: 4152723 (1979-05-01), McMahon et al.
patent: 4473842 (1984-09-01), Suzuki et al.
patent: 4536654 (1985-08-01), Vaerman
patent: 4589140 (1986-05-01), Bishop et al.
patent: 4641527 (1987-02-01), Hiroi et al.

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