Image analysis – Applications – Manufacturing or product inspection
Patent
1996-12-24
2000-05-09
Mancuso, Joseph
Image analysis
Applications
Manufacturing or product inspection
348126, 382150, G06K 900
Patent
active
060614668
ABSTRACT:
Disclosed is an apparatus and method for inspecting a connection state of a lead electrode to a bump after TAB (tape automated bonding). An LSI chip is immobilized on a stage. A flexible lead is held by a holding portion and connected to a bump. Above the chip, a CCD camera is provided. The stage is controlled to move up and down by a moving control mechanism. Each of the lead/bump connection states immediately after ILB (Inner lead bonding) is taken in the form of image data and defined as a first image data. A second image data of the lead/bump connection state is taken after the bump and lead are moved to different positions by moving the stage in order to change the position of the chip by means of the moving control mechanism. Whether or not the lead is duly connected to the bump is determined by the comparison of the first and second image data.
REFERENCES:
patent: 5249239 (1993-09-01), Kida
patent: 5495424 (1996-02-01), Tokura
patent: 5598345 (1997-01-01), Tokura
patent: 5901241 (1999-05-01), Koljonen et al.
patent: 5909285 (1999-06-01), Beaaty et al.
Hosomi Eiichi
Shibasaki Koji
Takubo Chiaki
Tazawa Hiroshi
Kabushiki Kaisha Toshiba
Mancuso Joseph
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