Apparatus and method for inspecting a semiconductor component

Details Apparatus and method for inspecting a semiconductor component Apparatus and method for inspecting a semiconductor component

2007-09-11

2007-09-11

Lauchman, Layla G. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

C356S239100, C356S300000, C356S432000

Reexamination Certificate

active

11076620

ABSTRACT:
Examination devices and methods operating with incident light have hitherto been used for the examination of wafers. To allow these devices also to be used with the transmitted-light method, it is proposed to configure the substrate holder (16) so that an illumination device (38, 40, 42) is integrated into the substrate holder (16) in such a way that transmitted-light illumination of the wafer (18) is possible.

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