Apparatus and method for inserting solder preforms on selected c

Details Apparatus and method for inserting solder preforms on selected c Apparatus and method for inserting solder preforms on selected c

1978-03-15

1979-03-06

Lanham, C.W.

Metal working

Method of mechanical manufacture

Electrical device making

29628, 29739, 29757, 29759, H05K 330

Patent

active

041422864

ABSTRACT:
An apparatus and method for inserting solder preforms on selected circuit board back plane pins. A template, drilled with a pattern of holes corresponding to the pattern of back plane pins and counterbored in hole positions corresponding to back plane pins which are to receive solder preforms, is positioned at an acute angle and vibrated at low frequency. Solder preforms are placed at the upper end of the template and due to the vibration and angle the template is positioned at, slide down the surface of the template and are trapped in the counterbored holes. The preform loaded side of the template is aligned with the circuit board back plane and the two are clamped together, causing the selected back plane pins to pass through the corresponding solder preforms positioned in the template's counterbored holes. The clamping circuit board and template are rotated so the template is positioned above the circuit board. The template is then removed, leaving the selected circuit board back plane pins with solder preforms inserted on them.

REFERENCES:
patent: 3286671 (1966-11-01), Fuller
patent: 3414962 (1968-12-01), Altamura
patent: 3468024 (1969-09-01), Yonkers
patent: 3667103 (1972-06-01), Petree
patent: 3736651 (1973-06-01), Law et al.
patent: 3744129 (1973-07-01), Dewey, Jr.
patent: 3785035 (1974-01-01), Busler et al.
patent: 3808681 (1974-05-01), Law et al.
patent: 3924325 (1975-12-01), Kufner
patent: 3932934 (1976-01-01), Lynch et al.
patent: 4089105 (1978-05-01), Yeo et al.

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