Apparatus and method for improving uniformity in electroplating

Details Apparatus and method for improving uniformity in electroplating Apparatus and method for improving uniformity in electroplating

2006-02-24

2010-12-07

Wilkins, III, Harry D (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

Reexamination Certificate

active

07846306

ABSTRACT:
A method and apparatus for plating a metal onto a substrate. One embodiment of the present invention provides an apparatus for electroplating a substrate. The apparatus comprises a fluid basin, an anode disposed near a bottom of the fluid basin, a restrictor disposed above the anode, and a substrate support member configured to move the substrate within the fluid basin among different elevations relative to the restrictor. Plating profiles on the substrate may be adjusted by changing the elevation of the substrate during plating.

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