Apparatus and method for forming solder seals for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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C257S738000

Reexamination Certificate

active

06956291

ABSTRACT:
An apparatus and method for forming a substantially continuous solder bump around the periphery of each dice on a flip chip wafer is disclosed. The solder bump is provided on each die so that when it is singulated from the wafer and mounted onto a substrate, the solder bump around the periphery acts to hermetically attach and seal the die to the substrate. According to various embodiments of the invention, the continuous solder bump may be coupled to either a ground plane or a power supply on the substrate. The method includes fabricating a plurality of integrated circuit dice on a first surface of a semiconductor wafer. After the integrated circuitry is fabricated, a substantially continuous solder bump is formed on the periphery of each of the dice on the wafer.

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