Apparatus and method for forming leads and removing tin dust fro

Wireworking – Crimping

Patent

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Details

72 40, B21F 4500

Patent

active

060858044

ABSTRACT:
A lead forming apparatus and a method for removing tin dust from the surface of the outer leads of semiconductor package are disclosed. The apparatus, in which a brushing operation removes tin dust from the outer leads, includes a supplier part; a lead forming part; a collection part; an intermediate post; a package transportation part; a brush block; and a brush transportation part. The method includes steps of providing a leadframe, forming the package leads, removing tin dust from the leads, and collecting the packages in a container.

REFERENCES:
patent: 3001280 (1961-09-01), Lyon
patent: 4829669 (1989-05-01), Nakajima

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