Wireworking – Crimping
Patent
1998-12-30
2000-07-11
Larson, Lowell A.
Wireworking
Crimping
72 40, B21F 4500
Patent
active
060858044
ABSTRACT:
A lead forming apparatus and a method for removing tin dust from the surface of the outer leads of semiconductor package are disclosed. The apparatus, in which a brushing operation removes tin dust from the outer leads, includes a supplier part; a lead forming part; a collection part; an intermediate post; a package transportation part; a brush block; and a brush transportation part. The method includes steps of providing a leadframe, forming the package leads, removing tin dust from the leads, and collecting the packages in a container.
REFERENCES:
patent: 3001280 (1961-09-01), Lyon
patent: 4829669 (1989-05-01), Nakajima
Bae Gyu Han
Choi Jun Hyuk
Choi Tai Kew
Na Byong Do
Larson Lowell A.
Millers David T.
Samsung Electronics Co,. Ltd.
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