Apparatus and method for flattening a warped substrate

Details Apparatus and method for flattening a warped substrate Apparatus and method for flattening a warped substrate

2007-05-08

2007-05-08

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Repair or restoration

C702S085000

Reexamination Certificate

active

10929179

ABSTRACT:
A method, apparatus, and computer program product for flattening a warped substrate. The substrate is placed on a planar surface of a clamping apparatus in direct mechanical contact with the planar surface. The substrate comprises surface regions S1, S2, . . . , SNhaving an average warpage of W1, W2, . . . , WN, respectively, wherein W1≦W2≦ . . . ≦WNand W1≦WN. Zones Z1, Z2, . . . , ZNof the planar surface respectively comprise vacuum port groups G1, G2, . . . , GN. Each group comprises at least one vacuum port. N is at least 2. A vacuum pressure PV1, PV2, . . . , PVNis generated at each vacuum port within group G1, G2, . . . , GN, at a time of T1, T2, . . . , TNto clamp surface region S1, S2, . . . , SNto zone Z1, Z2, . . . , ZN, respectively. The vacuum pressure PV1, PV2, . . . , PVNis maintained at the vacuum ports of group G1, G2, . . . , GN, respectively, until time TN+1. T1<T2< . . . <TN<TN+1.

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