Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
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Apparatus and method for flattening a warped substrate
Copper interconnection structure incorporating a metal seed...
Electroplated copper interconnection structure, process for...
Hydrogenated oxidized silicon carbon material
Low dielectric constant amorphous fluorinated carbon and...
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Profile ID: LFUS-PAI-P-2093043