Apparatus and method for film thickness measurement integrated i

Details Apparatus and method for film thickness measurement integrated i Apparatus and method for film thickness measurement integrated i

1998-03-31

2000-10-17

Rosenbaum, Mark

Abrading

Precision device or process - or with condition responsive...

By optical sensor

451 66, 451288, B24B 3700

Patent

active

06132289&

ABSTRACT:
A technique for integrating a film thickness monitoring sensor within a load and unload unit of a cluster tool for performing chemical-mechanical polishing (CMP). In order to determine CMP performance, a sensor (or sensors) for determining film thickness is/are integrated within the load and unload unit of the cluster tool. Accordingly, film thickness measurements can then be taken at discrete times during the processing cycle without removing the wafer from the cluster tool.

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