Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent
1997-08-21
2000-05-16
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
257781, H01L 2348, H01L 2352, H01L 2940
Patent
active
060641207
ABSTRACT:
An apparatus and method for face-down connection of a die to a substrate with polymer electrodes, the method comprising forming a plurality of conductive polymer electrodes on a substrate assembly; and elevating the temperature of the die sufficiently to cause electrical and fixed connection of the die to the electrodes upon appropriate contact; and then bringing the die face and electrodes into appropriate contact thereby forming the fixed and electrical connection.
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Cobbley Chad
Jiang Tongbi
Clark Sheila V.
Micro)n Technology, Inc.
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