Plastic and nonmetallic article shaping or treating: processes – With measuring – testing – or inspecting – Positioning of a mold part to form a cavity or controlling...
Reexamination Certificate
2007-08-08
2010-11-02
Davis, Robert B (Department: 1791)
Plastic and nonmetallic article shaping or treating: processes
With measuring, testing, or inspecting
Positioning of a mold part to form a cavity or controlling...
C264S272170, C425S127000, C425S135000, C425S141000
Reexamination Certificate
active
07824585
ABSTRACT:
An apparatus for fabricating semiconductor packages may include a thickness measurer configured to measure the thickness of a printed circuit board (PCB); mold dies, clamped to the top and the bottom of the PCB, through which a molding compound may be injected; and a pressure controller configured to control a clamp pressure of the mold die in response to the thickness of the PCB. The thickness of the PCB may be measured before molding the PCB, and a clamp pressure corresponding to the measured thickness may be decided. Therefore, it is possible to adjust the thickness variation of a PCB in real time, as they are being produced, to decrease the number of bad packages.
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Davis Robert B
Harness & Dickey & Pierce P.L.C.
Samsung Electronics Co,. Ltd.
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