Apparatus and method for enhanced thermal conductivity...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S113000

Reexamination Certificate

active

11486801

ABSTRACT:
An apparatus and method for an enhanced thermally conductive package for high powered semiconductor devices. The package includes a semiconductor die having an active surface and a non-active surface and a metal layer formed on the non-active surface of the die. The package is intended to be mounted onto a metal pad provided on a printed circuit board. A solder is used to affix the metal layer on the non-active surface of the die to the metal pad of the printed circuit board. The interface between the die and the printed circuit board thus includes just three metal layers, including the non-active surface of the die, the solder, and the metal pad on the printed circuit board. The reduced number of metal layers improves heat dissipation and thermal conductivity of the package.

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