Apparatus and method for distribution of slurry in a chemical me

Abrading – Machine – Rotary tool

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Details

451285, 451286, 451446, 451447, B24B 500

Patent

active

057095930

ABSTRACT:
Slurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible members, sweeps the slurry evenly and thinly across the polishing pad. A control system coordinates the distribution of slurry to the polishing pad with the motion of the carrier head.

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