Chemistry: electrical and wave energy – Apparatus – Electrolytic
Reexamination Certificate
2006-12-26
2006-12-26
Wilkins, III, Harry D (Department: 1742)
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C204S275100, C204S280000, C204S297010, C205S147000
Reexamination Certificate
active
07153400
ABSTRACT:
An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.
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Boyd John
de Larios John M.
Dordi Yezdi N.
Ravkin Mike
Redeker Fred C.
Lam Research Corporation
Martine & Penilla & Gencarella LLP
Wilkins, III Harry D
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