Apparatus and method for correcting pattern dimension and...

Radiation imagery chemistry: process – composition – or product th – Including control feature responsive to a test or measurement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S005000, C430S311000, C355S052000

Reexamination Certificate

active

07601471

ABSTRACT:
The width values of transferred patterns of respective evaluation patterns transferred using a test photo mask (11) are calculated by first calculation unit (12) based on the relationship with the opening ratio of flare generation patterns. The distribution of the calculated width values of the respective transferred patterns is linearly approximated by second calculation unit (13) and the inclination thereof is calculated. On the basis of a table defining the inclination of the width values of the respective transferred patterns (the ratio of dimension fluctuation), the amount of correction is changed for each pattern by correction unit (14). Consequently, the amount of dimension fluctuation caused by local flares can be accurately calculated. This enables accurately performing pattern-dimension corrections against local flares.

REFERENCES:
patent: 6370679 (2002-04-01), Chang et al.
patent: 6815129 (2004-11-01), Bjorkholm et al.
patent: 2001/0017693 (2001-08-01), Zheng et al.
patent: 2003/0068565 (2003-04-01), Won-Tai et al.
patent: 6-118614 (1994-04-01), None
patent: 2002-353130 (2002-12-01), None
patent: 2003-100624 (2003-04-01), None
patent: 2004-163670 (2004-06-01), None
Patent Abstracts of Japan, Publication No. 2002148779 A, published on May 22, 2002.
Patent Abstracts of Japan, Publication No. 2000235248 A, published on Aug. 29, 2000.
Patent Abstracts of Japan, Publication No. 09319067 A, published on Dec. 12, 1997.
Patent Abstracts of Japan, Publication No. 2002311563 A, published on Oct. 23, 2002.
Form PCT/ISA/237—Written Opinion issued in corresponding International Application No. PCT/JP2004/007173.
Chinese Office Action mailed Oct. 31, 2008 for a related patent application.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for correcting pattern dimension and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for correcting pattern dimension and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for correcting pattern dimension and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4128483

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.