Apparatus and method for cooling a substrate

Heat exchange – With retainer for removable article

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 802, 118728, 156345, F28F 700

Patent

active

056974272

ABSTRACT:
Apparatus and a concomitant method of supporting a substrate while providing effective backside cooling for the substrate. The apparatus comprises a platen having support pins, attached to the platen, for supporting a substrate in a spaced apart relation to the platen. The support pins cause a gap to be formed between the substrate and the platen. The platen contains at least one heat transfer medium supply portal that passes through the platen to supply a heat transfer medium to the gap between the substrate and platen. Lastly, the apparatus contains a flow control assembly, located proximate the peripheral edge of the substrate, for controlling the flow of the heat transfer medium through the gap between the platen and the substrate.

REFERENCES:
patent: H1145 (1993-03-01), Anderson
patent: 3711081 (1973-01-01), Cachon
patent: 4189230 (1980-02-01), Zasio
patent: 4542298 (1985-09-01), Holden
patent: 4671204 (1987-06-01), Ballou
patent: 4909314 (1990-03-01), Lamont, Jr.
patent: 4949783 (1990-08-01), Lakios et al.
patent: 5033538 (1991-07-01), Wagner et al.
patent: 5113929 (1992-05-01), Nakagawa et al.
patent: 5131460 (1992-07-01), Krueger
patent: 5180000 (1993-01-01), Wagner et al.
patent: 5199483 (1993-04-01), Bahng
patent: 5228501 (1993-07-01), Tepman et al.
patent: 5267607 (1993-12-01), Wada
patent: 5281320 (1994-01-01), Turner et al.
patent: 5307709 (1994-05-01), Kobayashi
patent: 5326725 (1994-07-01), Sherstinsky et al.
patent: 5382311 (1995-01-01), Ishikawa et al.
patent: 5421401 (1995-06-01), Sherstinsky et al.
patent: 5427670 (1995-06-01), Baggerman et al.
patent: 5446824 (1995-08-01), Moslehi

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for cooling a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for cooling a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for cooling a substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-198739

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.