Special receptacle or package – Combined or convertible – Packaged assemblage or kit
C428S447000, C428S450000, C428S145000, C428S688000
A probe cleaning apparatus for cleaning a probe tip use to test semiconductors dies having an abrasive substrate layer an a tacky gel layer on top of the abrasive surface of the abrasive substrate layer. The probe tip is cleaned by passing it through the tacky gel layer so that it comes in contact with the abrasive surface of the abrasive substrate, moving the probe tip across the abrasive surface of the substrate layer, and then removing the probe tip from the successive layers of the cleaning apparatus. The probe tip emerges from the cleaning apparatus free from debris associated with testing the semiconductor dies.
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Buckholtz Christopher C.
Drush Michael A.
Eldridge Benjamin N.
Grube Gary W.
Feely Michael J
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