Apparatus and method for cleaning semiconductor wafers

Electrolysis: processes – compositions used therein – and methods – Electrolytic material treatment – Water – sewage – or other waste water

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

205748, 205749, 205766, 204255, 204253, 204252, 134 13, C02F 1461

Patent

active

057257531

ABSTRACT:
An improvement is proposed in the cleaning treatment of semiconductor silicon wafers in which the conventional step of cleaning with an aqueous solution of an alkali is replaced with a cleaning treatment with a temporarily alkaline pure water which is produced electrolytically by the application of a DC voltage between a cathode and an anode bonded to the surfaces of a hydrogen-ion exchange membrane so that the alkaline cleaning treatment can be performed under mild conditions so as to eliminate the troubles due to formation of COPs unavoidable in the conventional process. In addition, the pure water rinse following the alkali cleaning of the wafers before transfer to the succeeding acidic cleaning step can be omitted to greatly contribute to the improvement of productivity. The apparatus used therefor comprises a rectangular vessel divided into a central cathode compartment, in which the wafers are held in a vertical disposition within an up-flow of pure water, and a pair of anode compartments by partitioning with a pair of hydrogen-ion exchange membranes, on both sides of which a cathode plate and anode plate are bonded.

REFERENCES:
patent: 5543030 (1996-08-01), Shiramizu et al.
patent: 5578193 (1996-11-01), Aoki et al.
Patent Abstracts of Japan, vol. 14, No. 9 (E-870), (JP 1-255226) 10 Jan. 1989. Jul. 1983.
Patent Abstracts of Japan, vol. 18, No. 684 (E-1650), (JP 6-275592) 22 Dec. 1994.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and method for cleaning semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and method for cleaning semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for cleaning semiconductor wafers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-136353

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.