Apparatus and method for breaking in multiple pad...

Details Apparatus and method for breaking in multiple pad... Apparatus and method for breaking in multiple pad...

2008-07-29

2008-07-29

Morgan, Eileen P. (Department: 3723)

Abrading

Accessory

Dressing

C451S285000, C451S415000

Reexamination Certificate

active

10873557

ABSTRACT:
An apparatus for breaking in new pad conditioning disks for use in a chemical mechanical polishing (CMP) system that polishes a semiconductor wafer by pressing the semiconductor wafer against a moving polishing pad. The apparatus comprises a break-in head that is removably attached to a drive shaft to which a polishing head that holds the semiconductor wafer is normally attached. The break-in head holds multiple pad conditioning disks and presses the plurality of pad conditioning disks against the moving polishing pad. The break-in head comprises a drive mechanism for rotating the multiple pad conditioning disks. The drive mechanism is coupled to the drive shaft and rotates the multiple pad conditioning disks by translating a rotating motion of the drive shaft into rotating motions of the multiple pad conditioning disks.

REFERENCES:
patent: 6695680 (2004-02-01), Choi et al.
patent: 6769972 (2004-08-01), Huang et al.
patent: 6837773 (2005-01-01), Brunelli
patent: 6935938 (2005-08-01), Gotkis et al.

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