Apparatus and method for applying RF power apparatus and method

Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma

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118723I, 118723IR, 438758, 438689, 333 33, H05H 124, H03H 738, C23C 1600

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active

06030667&

ABSTRACT:
On the bottom of a chamber, there is provided a lower electrode for supporting an object to be processed with intervention of an insulator. A first RF power source applies RF power to a multiple spiral coil composed of four spiral coil elements connected in parallel via an impedance matcher. The length of each of the coil elements corresponds to 1/4 of the wavelength of the RF power supplied from the first RF power source. A second RF power source applies an RF bias voltage to the lower electrode.

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