Apparatus and method for achieving via step coverage symmetry

Details Apparatus and method for achieving via step coverage symmetry Apparatus and method for achieving via step coverage symmetry

1990-12-27

1992-06-30

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20419217, 2042982, C23C 1435

Patent

active

051260298

ABSTRACT:
A magnetron sputtering apparatus and method for achieving via step coverage symmetry in a process for depositing a metal layer over a semiconductor substrate relies upon simultaneous rotational and lateral movements of the magnetron. When the magnetron is rotated and and moved laterally at the same time, the uniformity of the magnetic field across the target is improved significantly compared to prior art magnetron sputtering systems. Simultaneous rotational and lateral movements are achieved utilizing a planetary gear system.

REFERENCES:
patent: 4714536 (1987-12-01), Freeman et al.

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