Apparatus adapted to sense broken platen belt

Abrading – Precision device or process - or with condition responsive... – By optical sensor

Reexamination Certificate

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C451S005000, C451S008000

Reexamination Certificate

active

07137870

ABSTRACT:
Embodiments of a wafer polishing and broken platen belt sensing apparatus are disclosed, wherein the apparatus comprises a polishing platen, a motor, a platen belt, a photo sensor, and an encoder connected to the motor and adapted to output a first signal in accordance with the rotational speed of the motor. In one embodiment, the apparatus comprises a photo sensor adapted to output a second signal in accordance with the rotational speed of the polishing platen and is adapted to generate an interlock signal when the motor and the polishing platen are not both rotating normally. In another embodiment, the apparatus comprises a photo sensor adapted to output the second signal in accordance with the rotational speed of the platen belt and is adapted to generate an interlock signal when the motor and the platen belt are not both rotating normally.

REFERENCES:
patent: 5816970 (1998-10-01), Chae
patent: 6413873 (2002-07-01), Li et al.
patent: 6532810 (2003-03-01), Ahmed
patent: 6887129 (2005-05-01), Birang et al.
patent: 2003/0128127 (2003-07-01), Jan

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