Abrading – Precision device or process - or with condition responsive... – By optical sensor
Reexamination Certificate
2006-11-21
2006-11-21
Nguyen, Dung Van (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
By optical sensor
C451S005000, C451S008000
Reexamination Certificate
active
07137870
ABSTRACT:
Embodiments of a wafer polishing and broken platen belt sensing apparatus are disclosed, wherein the apparatus comprises a polishing platen, a motor, a platen belt, a photo sensor, and an encoder connected to the motor and adapted to output a first signal in accordance with the rotational speed of the motor. In one embodiment, the apparatus comprises a photo sensor adapted to output a second signal in accordance with the rotational speed of the polishing platen and is adapted to generate an interlock signal when the motor and the polishing platen are not both rotating normally. In another embodiment, the apparatus comprises a photo sensor adapted to output the second signal in accordance with the rotational speed of the platen belt and is adapted to generate an interlock signal when the motor and the platen belt are not both rotating normally.
REFERENCES:
patent: 5816970 (1998-10-01), Chae
patent: 6413873 (2002-07-01), Li et al.
patent: 6532810 (2003-03-01), Ahmed
patent: 6887129 (2005-05-01), Birang et al.
patent: 2003/0128127 (2003-07-01), Jan
Nguyen Dung Van
Samsung Electronics Co,. Ltd.
Volentine Francos & Whitt PLLC
LandOfFree
Apparatus adapted to sense broken platen belt does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus adapted to sense broken platen belt, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus adapted to sense broken platen belt will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3693791