Aperture masks for circuit fabrication

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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Details

C438S401000, C438S551000, C438S800000, C257SE21024, C257SE21033, C257SE21038

Reexamination Certificate

active

11118811

ABSTRACT:
Aperture masks and deposition techniques for using aperture masks are described. In addition, techniques for creating aperture masks and other techniques for using the aperture masks are described. The various techniques can be particularly useful in creating circuit elements for electronic displays and low-cost integrated circuits such as radio frequency identification (RFID) circuits. In addition, the techniques can be advantageous in the fabrication of integrated circuits incorporating organic semiconductors, which typically are not compatible with wet processes.

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U.S. Appl. No. 11/258,330, filed Oct. 25, 2005, entitled “Aperture Masks for Circuit Fabrication”.

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